Title: Large Area Electronics – Scaling up to volume manufacture
Technologies for Large Area and Printable Electronics are well established and are steadily moving along the Technology Readiness Level scale. It is apparent that most electronic systems which make use of these technologies will be hybrids of conventional solid-state components and a range of the newer technologies. The next stages for the evolution of printable and LAE include its integration as part of the electronic and system engineer’s toolbox. In this talk, CPI will briefly review the progress made in the design, prototyping and production of a 10000-part pilot production run for a fully integrated smart label using NFC technology
Mike is the Head of Technology within the CPI Printable Electronics platform. He is responsible for providing technical leadership, developing technologies so that they can be translated to innovative products capable of commercialization in the future. Mike has 25 years’ experience within the electronics field working within research and development, mass production and customer service environments. He has worked for medium size British companies and major international blue chip organisations such as Fujitsu Microelectronics, NXP, Filtronic Compound Semiconductors and RFMD. His knowledge base spans Operations management, process engineering and integration, technology development, yield enhancement and project management.
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